• DocumentCode
    1548990
  • Title

    Dislocation-assisted-diffusion model for the kinetics of bismuth cuprate 2212-to-2223 transformation

  • Author

    Zhi-Xiong Cai ; Yimei Zhu

  • Author_Institution
    Div. of Mater. Sci., Brookhaven Nat. Lab., Upton, NY, USA
  • Volume
    9
  • Issue
    2
  • fYear
    1999
  • fDate
    6/1/1999 12:00:00 AM
  • Firstpage
    2714
  • Lastpage
    2717
  • Abstract
    Recent transmission electron microscopy (TEM) experiments have shown that the transformation of the Bi cuprate 2212 phase to 2223 phase consists of random intercalation and fast growth of Ca/CuO/sub 2/ planes in the Bi-2212 matrix. This contradicts the prediction of the conventional nucleation and growth theory. A model is proposed which considers the cylindrical void created by the edge dislocation due to the insertion of a Ca/CuO/sub 2/ plane to be a channel for fast ion diffusion. The experimentally observed time dependence of the volume fraction of Bi-2223 during the transformation is found to be consistent with a one-dimensional diffusion-controlled transformation mechanism, as predicted by our model. The formation energy of Bi-2223 is estimated and is consistent with the results of atomistic simulations.
  • Keywords
    bismuth compounds; calcium compounds; diffusion; edge dislocations; high-temperature superconductors; lead compounds; solid-state phase transformations; strontium compounds; transmission electron microscopy; voids (solid); 2212-to-2223 transformation; Bi cuprate; BiPbSrCaCuO; Ca/CuO/sub 2/ planes; TEM; atomistic simulations; cylindrical void; dislocation-assisted-diffusion model; edge dislocation; fast ion diffusion; formation energy; kinetics; one-dimensional diffusion-controlled transformation mechanism; random intercalation; time dependence; transmission electron microscopy; volume fraction; Annealing; Bismuth; Fabrication; Kinetic theory; Lattices; Superconducting filaments and wires; Superconducting films; Superconducting materials; Superconductivity; Transmission electron microscopy;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.785046
  • Filename
    785046