DocumentCode
1548990
Title
Dislocation-assisted-diffusion model for the kinetics of bismuth cuprate 2212-to-2223 transformation
Author
Zhi-Xiong Cai ; Yimei Zhu
Author_Institution
Div. of Mater. Sci., Brookhaven Nat. Lab., Upton, NY, USA
Volume
9
Issue
2
fYear
1999
fDate
6/1/1999 12:00:00 AM
Firstpage
2714
Lastpage
2717
Abstract
Recent transmission electron microscopy (TEM) experiments have shown that the transformation of the Bi cuprate 2212 phase to 2223 phase consists of random intercalation and fast growth of Ca/CuO/sub 2/ planes in the Bi-2212 matrix. This contradicts the prediction of the conventional nucleation and growth theory. A model is proposed which considers the cylindrical void created by the edge dislocation due to the insertion of a Ca/CuO/sub 2/ plane to be a channel for fast ion diffusion. The experimentally observed time dependence of the volume fraction of Bi-2223 during the transformation is found to be consistent with a one-dimensional diffusion-controlled transformation mechanism, as predicted by our model. The formation energy of Bi-2223 is estimated and is consistent with the results of atomistic simulations.
Keywords
bismuth compounds; calcium compounds; diffusion; edge dislocations; high-temperature superconductors; lead compounds; solid-state phase transformations; strontium compounds; transmission electron microscopy; voids (solid); 2212-to-2223 transformation; Bi cuprate; BiPbSrCaCuO; Ca/CuO/sub 2/ planes; TEM; atomistic simulations; cylindrical void; dislocation-assisted-diffusion model; edge dislocation; fast ion diffusion; formation energy; kinetics; one-dimensional diffusion-controlled transformation mechanism; random intercalation; time dependence; transmission electron microscopy; volume fraction; Annealing; Bismuth; Fabrication; Kinetic theory; Lattices; Superconducting filaments and wires; Superconducting films; Superconducting materials; Superconductivity; Transmission electron microscopy;
fLanguage
English
Journal_Title
Applied Superconductivity, IEEE Transactions on
Publisher
ieee
ISSN
1051-8223
Type
jour
DOI
10.1109/77.785046
Filename
785046
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