Title :
Continuous multistrand assembly techniques for Ag clad superconducting wire
Author :
DeMoranville, K. ; Antaya, P. ; Martin, C. ; Li, Q. ; Riley, G.N., Jr. ; Hancock, S. ; Simpson, M. ; Marquardt, J. ; Tatelbaum, D.
Author_Institution :
American Supercond. Corp., Westboro, MA, USA
fDate :
6/1/1999 12:00:00 AM
Abstract :
A method to continuously combine and deform silver clad superconducting strands has been developed. This technique has been used to fabricate multifilament superconducting tapes consisting of Bi-2223, high temperature superconducting precursors. Results show that silver has the unique ability to be bonded together in a continuous strand process without requiring a protective atmosphere. The approach uses a continuous process to combine relatively fine wires that are aligned in the desired configuration, held in intimate contact and heat-treated to promote metallurgical bonding. Silver grain growth across strand interfaces has been documented in processed tapes and lengths approaching 100 meters have been fabricated. Engineering critical current densities (J/sub c/) as high as 19000 amps/cm/sup 2/ (77 K, self-field, 1 /spl mu/V/cm) have been recorded in short samples.
Keywords :
bismuth compounds; calcium compounds; critical current density (superconductivity); grain growth; heat treatment; high-temperature superconductors; materials preparation; multifilamentary superconductors; silver; strontium compounds; superconducting tapes; Ag clad superconducting wire; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10/; Bi/sub 2/Sr/sub 2/Ca/sub 2/Cu/sub 3/O/sub 10/-Ag; continuous multistrand assembly; continuous strand process; critical current density; grain growth; heat-treatment; high temperature superconducting precursors; metallurgical bonding; multifilament superconducting tapes; strand interfaces; Assembly; Atmosphere; Bonding; Critical current density; High temperature superconductors; Multifilamentary superconductors; Protection; Silver; Superconducting filaments and wires; Superconducting films;
Journal_Title :
Applied Superconductivity, IEEE Transactions on