• DocumentCode
    1549337
  • Title

    MIMIC from the Department of Defense perspective

  • Author

    Cohen, Eliot D.

  • Author_Institution
    Defense Adv. Res. Projects Agency, Arlington, VA, USA
  • Volume
    38
  • Issue
    9
  • fYear
    1990
  • fDate
    9/1/1990 12:00:00 AM
  • Firstpage
    1171
  • Lastpage
    1174
  • Abstract
    The microwave and millimeter wave monolithic integrated circuits (MIMIC) program is a Defense Advanced Research Projects Agency initiative to provide affordable, reliable, and reproducible microwave and millimeter-wave circuits in monolithic format for use in US Department of Defense (DoD) systems. The objectives of the program, progress being made toward meeting those objectives, and some planned future work are described. The overall program object is to provide the needed microwave and millimeter-wave products at a price that will allow their use in fielded DoD systems, that meet all required electrical, mechanical, and environmental parameters, and that continue to operate reliably for the time necessary to fulfil their intended application. Programs in progress include work on gallium arsenide epitaxial growth techniques; multiple chip ceramic packages, process, device, and circuit modeling; on-wafer testing techniques; and advanced fabrication techniques
  • Keywords
    MMIC; military systems; research initiatives; Department of Defense perspective; GaAs epitaxial growth; MIMIC; MMIC; advanced fabrication; device modeling; electrical parameters; environmental parameters; fielded DoD systems; mechanical parameters; millimeter wave monolithic integrated circuits; multiple chip ceramic packages; on-wafer testing; process modeling; reliability; Ceramics; Circuit testing; Epitaxial growth; Gallium arsenide; Integrated circuit reliability; MIMICs; Meeting planning; Millimeter wave circuits; Millimeter wave technology; Monolithic integrated circuits;
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/22.58639
  • Filename
    58639