• DocumentCode
    1549623
  • Title

    Analysis and Fabrication of Curved Multimorph Transducers That Undergo Bending and Twisting

  • Author

    Pal, Sagnik ; Xie, Huikai

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Florida, Gainesville, FL, USA
  • Volume
    21
  • Issue
    5
  • fYear
    2012
  • Firstpage
    1241
  • Lastpage
    1251
  • Abstract
    Difference in strains in the layers of a multimorph beam causes it to curl, thereby leading to transduction. Straight multimorph beams have been widely used for thermal, piezoelectric, and shape-memory-alloy-based transducers that undergo out-of-plane bending, but curved multimorph beams have not been explored much. In this paper, we report thermal transducers based on curved multimorphs that have a nonzero curvature in the plane of the substrate. The distinguishing feature of curved multimorphs is that they undergo both out-of-plane bending and twisting deformations. We report the small-deformation analysis of curved multimorphs. The analytical expressions greatly expand the design space for microelectromechanical systems engineers and can lead to novel devices, including micromirrors and infrared sensors. The closed-form expressions were validated against finite-element (FE) simulation and experimental results. Experimental verification was done by monitoring a curved electrothermal multimorph beam at different temperatures. Good agreement between the analysis and experiments has been observed in the small-deformation range. At large deformations, in-plane displacement becomes significant. FE simulations and experiments are used to study large deformations.
  • Keywords
    bending; finite element analysis; microsensors; temperature sensors; FE simulation; curved electrothermal multimorph beam; curved multimorph transducer fabrication; design space; finite-element simulation; in-plane displacement; infrared sensor; microelectromechanical system; micromirror; nonzero curvature; out-of-plane bending; piezoelectric transducer; shape-memory-alloy-based transducer; small-deformation analysis; straight multimorph beam; strain; thermal transducer; transduction; twisting deformation; Closed-form solutions; Equations; Force; Microelectromechanical systems; Micromirrors; Strain; Transducers; Curved bimorph; curved multimorph; force sensor; infrared sensor; microelectromechanical systems (MEMS); micromirrors; multimorph; photothermal spectroscopy; thermal sensor;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2012.2203104
  • Filename
    6227322