• DocumentCode
    1549992
  • Title

    THz interconnect with low-loss and low-group velocity dispersion

  • Author

    Mendis, R. ; Grischkowsky, D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK, USA
  • Volume
    11
  • Issue
    11
  • fYear
    2001
  • Firstpage
    444
  • Lastpage
    446
  • Abstract
    We report the demonstration of a physically flexible, practicable THz interconnect with minimal pulse distortion and loss. The interconnect is a parallel-plate waveguide, with the TEM mode excited, constructed of two thin copper strips. The incoming 0.22 ps THz pulse broadens to 0.39 ps after propagating 250 mm in the waveguide and is also attenuated by a factor of ten. We show that this attenuation is mainly due to the finite conductivity of copper with some additional loss caused by the beam spread in the unguided dimension. The pulse broadening is due to the frequency-dependent loss since the group velocity dispersion is negligible.
  • Keywords
    copper; dispersion (wave); electric distortion; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; losses; parallel plate waveguides; 0.22 to 0.39 ps; 250 mm; Cu; beam spread; finite conductivity; frequency-dependent loss; group velocity dispersion; high speed devices; parallel-plate waveguide; pulse broadening; pulse distortion; quasioptic coupling; single electronic chip level; subpicosecond pulse; terahertz interconnect; Attenuation; Conductivity; Copper; Frequency; Microwave devices; Microwave propagation; Optical attenuators; Optical losses; Optical waveguides; Strips;
  • fLanguage
    English
  • Journal_Title
    Microwave and Wireless Components Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1531-1309
  • Type

    jour

  • DOI
    10.1109/7260.966036
  • Filename
    966036