DocumentCode
1549992
Title
THz interconnect with low-loss and low-group velocity dispersion
Author
Mendis, R. ; Grischkowsky, D.
Author_Institution
Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK, USA
Volume
11
Issue
11
fYear
2001
Firstpage
444
Lastpage
446
Abstract
We report the demonstration of a physically flexible, practicable THz interconnect with minimal pulse distortion and loss. The interconnect is a parallel-plate waveguide, with the TEM mode excited, constructed of two thin copper strips. The incoming 0.22 ps THz pulse broadens to 0.39 ps after propagating 250 mm in the waveguide and is also attenuated by a factor of ten. We show that this attenuation is mainly due to the finite conductivity of copper with some additional loss caused by the beam spread in the unguided dimension. The pulse broadening is due to the frequency-dependent loss since the group velocity dispersion is negligible.
Keywords
copper; dispersion (wave); electric distortion; high-speed integrated circuits; integrated circuit design; integrated circuit interconnections; losses; parallel plate waveguides; 0.22 to 0.39 ps; 250 mm; Cu; beam spread; finite conductivity; frequency-dependent loss; group velocity dispersion; high speed devices; parallel-plate waveguide; pulse broadening; pulse distortion; quasioptic coupling; single electronic chip level; subpicosecond pulse; terahertz interconnect; Attenuation; Conductivity; Copper; Frequency; Microwave devices; Microwave propagation; Optical attenuators; Optical losses; Optical waveguides; Strips;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/7260.966036
Filename
966036
Link To Document