DocumentCode
1550010
Title
Analysis of failure mechanisms in velocity-matched distributed photodetectors
Author
Nespola, A. ; Chau, T. ; Wu, M.C. ; Ghione, G.
Author_Institution
Dipt. di Elettronica, Politecnico di Torino, Italy
Volume
146
Issue
1
fYear
1999
fDate
8/1/1999 12:00:00 AM
Firstpage
25
Lastpage
30
Abstract
The thermal-runaway process in long-wavelength velocity-matched distributed photodetectors (VMDP) with metal-semiconductor-metal photodiodes has been investigated. A three-dimensional numerical electrothermal model has been developed which takes into account the nonlinear thermal properties of the substrate and the nonuniform temperature rise due to self heating. The model shows that, owing to its distributed nature, the photodetector is able to operate at high optical power level before catastrophic failure occurs. When this happens, a highly localised hot spot appears within the device and characteristic exhibits a typical current point, where the current rapidly increases with increasing bias voltage. Examples are discussed to highlight the thermal behaviour of the distributed detector and to compare the model with experimental data
Keywords
metal-semiconductor-metal structures; photodetectors; photodiodes; semiconductor device models; semiconductor device reliability; thermal conductivity; 3D numerical electrothermal model; catastrophic failure; distributed detector; failure mechanisms; highly localised hot spot; increasing bias voltage; long-wavelength velocity-matched distributed photodetectors; metal-semiconductor-metal photodiodes; nonlinear thermal properties; nonuniform temperature rise; photodetector; self heating; thermal behaviour; thermal-runaway process; three-dimensional numerical electrothermal model; velocity-matched distributed photodetector;
fLanguage
English
Journal_Title
Optoelectronics, IEE Proceedings -
Publisher
iet
ISSN
1350-2433
Type
jour
DOI
10.1049/ip-opt:19990457
Filename
787770
Link To Document