• DocumentCode
    1550577
  • Title

    Statistical modeling of transmission line model test structures. II. TLM test structure with four or more terminals: a novel method to characterize nonideal planar contacts in presence of inhomogeneities

  • Author

    Gutai, Laszlo

  • Author_Institution
    Philips Components-Signetics Co., Sunnyvale, CA, USA
  • Volume
    37
  • Issue
    11
  • fYear
    1990
  • fDate
    11/1/1990 12:00:00 AM
  • Firstpage
    2361
  • Lastpage
    2380
  • Abstract
    For pt.I see ibid., vol.37, pp.2350-2360, Nov. 1990. A modified transmission line model (redundant TLM or RTLM) test structure (with four or more terminals) and a novel data extraction method are suggested to improve the accuracy of the TLM method. Statistical modeling by both statistical simulation and the method of error propagation shows that with four terminals and independently known sheet resistances between the contacts, the errors of the extracted parameters can be reduced considerably. With the use of five or more terminals, the accuracy of the parameter extraction can also be determined by a single structure, allowing the separation of inhomogeneities within a test structure from the inhomogeneities over the wafer. Experimental data gathered by Kelvin cross-bridge resistors and by traditional and modified transmission line model structures on Al-Si-Cu/TiW/p-n Si contacts clearly show the advantage of the RTLM method over the traditional TLM method. On a wafer with small inhomogeneities, both methods gave consistent results
  • Keywords
    electrical conductivity measurement; measurement errors; ohmic contacts; semiconductor-metal boundaries; statistical analysis; Kelvin cross-bridge resistors; RTLM; TLM test structure; characterize nonideal planar contacts; data extraction method; four terminals; inhomogeneities; measurement error reduction; method of error propagation; modified transmission line model; redundant TLM; separation of inhomogeneities; statistical simulation; transmission line model test structures; Conductivity; Contact resistance; Data mining; Kelvin; Parameter extraction; Planar transmission lines; Resistors; Semiconductor device modeling; Testing; Transmission lines;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.62288
  • Filename
    62288