DocumentCode
1550577
Title
Statistical modeling of transmission line model test structures. II. TLM test structure with four or more terminals: a novel method to characterize nonideal planar contacts in presence of inhomogeneities
Author
Gutai, Laszlo
Author_Institution
Philips Components-Signetics Co., Sunnyvale, CA, USA
Volume
37
Issue
11
fYear
1990
fDate
11/1/1990 12:00:00 AM
Firstpage
2361
Lastpage
2380
Abstract
For pt.I see ibid., vol.37, pp.2350-2360, Nov. 1990. A modified transmission line model (redundant TLM or RTLM) test structure (with four or more terminals) and a novel data extraction method are suggested to improve the accuracy of the TLM method. Statistical modeling by both statistical simulation and the method of error propagation shows that with four terminals and independently known sheet resistances between the contacts, the errors of the extracted parameters can be reduced considerably. With the use of five or more terminals, the accuracy of the parameter extraction can also be determined by a single structure, allowing the separation of inhomogeneities within a test structure from the inhomogeneities over the wafer. Experimental data gathered by Kelvin cross-bridge resistors and by traditional and modified transmission line model structures on Al-Si-Cu/TiW/p-n Si contacts clearly show the advantage of the RTLM method over the traditional TLM method. On a wafer with small inhomogeneities, both methods gave consistent results
Keywords
electrical conductivity measurement; measurement errors; ohmic contacts; semiconductor-metal boundaries; statistical analysis; Kelvin cross-bridge resistors; RTLM; TLM test structure; characterize nonideal planar contacts; data extraction method; four terminals; inhomogeneities; measurement error reduction; method of error propagation; modified transmission line model; redundant TLM; separation of inhomogeneities; statistical simulation; transmission line model test structures; Conductivity; Contact resistance; Data mining; Kelvin; Parameter extraction; Planar transmission lines; Resistors; Semiconductor device modeling; Testing; Transmission lines;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.62288
Filename
62288
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