Automatic classification of wafer defects: status and industry needs

Author

Shapiro, Arye

Author_Institution

Adv. Micro Devices Inc., Austin, TX, USA

Volume

20

Issue

2

fYear

1997

fDate

4/1/1997 12:00:00 AM

Firstpage

164

Lastpage

167

Abstract

This paper describes the automatic defect classification (ADC) beta site evaluations performed as part of the SEMATECH ADC project. Two optical review microscopes equipped with ADC software were independently evaluated in manufacturing environments. Both microscopes were operated in bright-field mode with white light illumination, ADC performance was measured on three process levels of random logic devices: source/drain, polysilicon gate, and metal. ADC performance metrics included classification accuracy, repeatability, and speed. In particular, ADC software was tested using a protocol that included knowledge base tests, gauge studies, and small passive data collections

Keywords

automatic optical inspection; computerised instrumentation; integrated circuit manufacture; optical microscopy; pattern classification; production testing; SEMATECH ADC project; automatic classification; automatic defect classification software; beta site evaluations; bright-field mode; classification accuracy; gauge studies; knowledge base tests; manufacturing environment; optical review microscopes; repeatability; small passive data collections; wafer defects; white light illumination; High speed optical techniques; Inspection; Logic devices; Manufacturing industries; Measurement; Optical microscopy; Optical sensors; Performance evaluation; Scanning electron microscopy; Software testing;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part C, IEEE Transactions on

Publisher

ieee

ISSN

1083-4400

Type

jour

DOI

10.1109/3476.622886

Filename

622886