Modeling of interconnections and isolation within a multilayered ball grid array package

Author

Ito, Ryosuke ; Jackson, Robert W. ; Hongsmatip, Thongchai

Author_Institution

Dept. of Electr. & Comput. Eng., Massachusetts Univ., Amherst, MA, USA

Volume

47

Issue

9

fYear

1999

fDate

9/1/1999 12:00:00 AM

Firstpage

1819

Lastpage

1825

Abstract

A procedure is described for the electrical modeling of multilayered ball grid array (BGA) packages for use in microwave applications. The modeled package is divided into layers and a lumped-clement circuit model is developed for each layer/interconnection. A simple numerical method for computing the parasitic coupling between transitions at different locations within a layer is presented and integrated with the lumped-element model. The model is verified by comparison to measurements of a test package. This modeling procedure is useful for determining the cause of low isolation in BGA packages at microwave frequencies

Keywords

MMIC; ball grid arrays; integrated circuit packaging; multichip modules; electrical modeling; isolation; lumped-clement circuit model; microwave applications; multilayered ball grid array package; parasitic coupling; transitions; Circuit testing; Electronics packaging; Indium tin oxide; Integrated circuit interconnections; Integrated circuit packaging; MMICs; Microwave integrated circuits; Nonhomogeneous media; Power system modeling; Radio frequency;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.788517

Filename

788517