A study on thermal-stress-reliability of Si-based PLC substrate

Author

Kitazawa, Iwao ; Mino, Shinji ; Hibino, Yoshinori

Author_Institution

NTT Opt. Network Syst. Labs., Kanagawa, Japan

Volume

20

Issue

3

fYear

1997

fDate

9/1/1997 12:00:00 AM

Firstpage

327

Lastpage

333

Abstract

Planar lightwave technology is rapidly advancing and promises excellent performance as economical opto-electro-devices. To confirm its feasibility, it is very important to estimate its mechanical reliability especially against the thermal stresses caused by the difference of the thermal expansion coefficients of Silicon and silica glass. This paper examines the thermal strain and stress distribution on silicon-based Planar-Lightwave-Circuits (PLC) substrates and the stress concentration on silicon terrace structures prepared for mounting active optical devices. Experimental data on the fracture strength of silicon obtained by three-point-bending tests are given. Finally, the thermal-stress-reliability of PLC substrates based on probabilistic analysis is calculated and it is confirmed that the PLC substrate, even its present form, is reliable enough for a new family of optical components

Keywords

deformation; elemental semiconductors; fracture; fracture toughness; integrated circuit packaging; integrated circuit reliability; integrated optoelectronics; materials testing; mechanical strength; optical planar waveguides; probability; silicon; substrates; thermal expansion; thermal stresses; Si; Si terrace structures; Si-based PLC substrate; active optical devices; fracture strength; mechanical reliability; optoelectro-devices; planar lightwave circuits; probabilistic analysis; silica glass; stress concentration; thermal expansion coefficients; thermal strain distribution; thermal stress distribution; thermal stress reliability; three-point-bending tests; Capacitive sensors; Glass; Optical devices; Programmable control; Residual stresses; Silicon compounds; Temperature; Tensile stress; Thermal expansion; Thermal stresses;

fLanguage

English

Journal_Title

Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on

Publisher

ieee

ISSN

1070-9886

Type

jour

DOI

10.1109/95.623027

Filename

623027