DocumentCode
1551243
Title
Bountiful Baseband
Author
Collins, L.
Volume
6
Issue
4
fYear
2011
fDate
5/1/2011 12:00:00 AM
Firstpage
63
Lastpage
65
Abstract
The uptake of smartphones is driving rapid innovation in the chips that enable them. At the low end, handset makers want affordable devices for emerging markets. At the high end, demand for advanced features such as 3D HD playback is seeing chipmakers push manufacturing processes to the limit. Meanwhile, there have been key advances in the air interface and control of the modem design.
Keywords
design engineering; innovation management; microprocessor chips; mobile computing; mobile handsets; telecommunication computing; telecommunication industry; user interfaces; 3D HD playback; advanced features; affordable devices; air interface; bountiful baseband; chipmakers; chips; emerging markets; handset makers; manufacturing processes; modern design; rapid innovation; smartphones;
fLanguage
English
Journal_Title
Engineering & Technology
Publisher
iet
ISSN
1750-9637
Type
jour
Filename
5871757
Link To Document