DocumentCode :
1551377
Title :
CARAMEL: Contamination And Reliability Analysis of MicroElectromechanical Layout
Author :
Kolpekwar, Abhijeet ; Jiang, Tao ; Blanton, R. D Shawn
Author_Institution :
Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA
Volume :
8
Issue :
3
fYear :
1999
fDate :
9/1/1999 12:00:00 AM
Firstpage :
309
Lastpage :
318
Abstract :
CARAMEL (Contamination And Reliability Analysis of MicroElectromechanical Layout) is a CAD tool for MEMS fault model generation. It is based on the integrated circuit contamination analysis tool CODEF and is capable of analyzing the impact of contamination particles on the behavior of microelectromechanical systems. CARAMEL´s simulation output indicates that a wide range of defective structures are possible due to the presence of particulate contaminations. Moreover, electromechanical simulations of CARAMEL´s mesh representations of defective layout has revealed that a wide variety of misbehaviors are associated with these defects. Several thousand contamination simulations were performed using CARAMEL on the surface micromachined comb-drive resonator. The results generated by CARAMEL identifies the comb drive as the most defect prone region of the microresonator and the deposition of the first structural layer as the most vulnerable processing step
Keywords :
CAD; micromechanical resonators; reliability theory; surface contamination; CAD tool; CARAMEL; MEMS fault model generation; comb-drive resonator; defective layout; electromechanical simulation; microelectromechanical system; microresonator; particulate contamination; reliability analysis; surface micromachining; Atmospheric modeling; Circuit analysis; Circuit faults; Circuit simulation; Design for testability; Fault diagnosis; Integrated circuit reliability; Micromechanical devices; Surface contamination; Testing;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/84.788635
Filename :
788635
Link To Document :
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