Title :
Fabrication and Characterization of Thin-Barrier
HEMTs
Author :
Felbinger, Jonathan G. ; Fagerlind, Martin ; Axelsson, Olle ; Rorsman, Niklas ; Gao, Xiang ; Guo, Shiping ; Schaff, William J. ; Eastman, Lester F.
Author_Institution :
Dept. of Microtechnol. & Nanosci. (MC2), Chalmers Univ. of Technol., Goteborg, Sweden
fDate :
7/1/2011 12:00:00 AM
Abstract :
The growth, fabrication, and performance of Al0.5Ga0.5 N/AlN/GaN high-electron-mobility transistors (HEMTs) with a total barrier thickness of 7 nm are reported. An optimized surface passivation and an ohmic recess etch yield HEMTs exhibiting 0.72 S/mm peak extrinsic dc transconductance at a current density of 0.47 A/mm. Devices with a gate length of 90 nm achieve 78 GHz unity-current-gain frequency and up to 166 GHz maximum frequency of oscillation. The minimum noise figure at 10 GHz is 0.52 dB with an associated gain of 9.5 dB.
Keywords :
III-V semiconductors; aluminium compounds; current density; etching; gallium compounds; high electron mobility transistors; passivation; semiconductor device noise; wide band gap semiconductors; Al0.5Ga0.5N-AlN-GaN; current density; high electron mobility transistor; ohmic recess etch yield; optimized surface passivation; peak extrinsic dc transconductance; semiconductor device noise; thin-barrier HEMT fabrication; unity current gain frequency; Aluminum gallium nitride; Gallium nitride; HEMTs; Logic gates; MODFETs; Noise; Aluminum gallium nitride; high-electron-mobility transistors (HEMTs); microwave noise; recessed ohmic contacts; surface passivation;
Journal_Title :
Electron Device Letters, IEEE
DOI :
10.1109/LED.2011.2143384