DocumentCode :
1553008
Title :
Comments on ´Electro-thermal device and circuit simulation with thermal nonlinearity due to temperature dependent diffusivity´
Author :
Krabbenhoft, K. ; Damkilde, L.
Author_Institution :
Dept. of Civil Eng., Tech. Univ. Denmark, Lyngby, Denmark
Volume :
37
Issue :
24
fYear :
2001
fDate :
11/22/2001 12:00:00 AM
Firstpage :
1481
Lastpage :
1482
Abstract :
Recently, a semi-analytical method for dealing with the transient diffusion equation for circuit simulation with temperature dependent thermal properties has been proposed by Batty and Snowden [see ibid., vol. 36, no. 23, p. 1966-8 (2000).]. However, in the derivation of the method a mistake is made which may lead to inaccurate results, especially in the case where the thermal properties vary strongly with the temperature. For the sake of convenience we shall consider the one dimensional diffusion equation without sources. The authors´ reply is included
Keywords :
circuit simulation; thermal diffusivity; thermal resistance; transient analysis; circuit simulation; electro-thermal device; one dimensional diffusion equation; semi-analytical method; temperature dependent diffusivity; thermal nonlinearity; thermal properties; transient diffusion equation;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:20010991
Filename :
970407
Link To Document :
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