• DocumentCode
    1553293
  • Title

    An ion-assisted Mo-Si deposition process for planarizing reticle substrates for extreme ultraviolet lithography

  • Author

    Mirkarimi, Paul B. ; Spiller, Eberhard A. ; Stearns, Daniel G. ; Sperry, Victor ; Baker, Sherry L.

  • Author_Institution
    Lawrence Livermore Nat. Lab., Berkeley, CA, USA
  • Volume
    37
  • Issue
    12
  • fYear
    2001
  • fDate
    12/1/2001 12:00:00 AM
  • Firstpage
    1514
  • Lastpage
    1516
  • Abstract
    Substrate particles are a serious concern in the fabrication of reticles for extreme ultraviolet lithography (EUVL) because they nucleate defects in the reflective multilayer films that can print in the lithographic image. We have developed a strategy for planarizing reticle substrates with smoothing-layers and, in this letter, we investigate the smoothing properties of an ion-assisted Mo-Si deposition process. We have observed that ion-assistance can significantly improve the particle-smoothing properties of Mo-Si multilayer films and can do so without a significant increase in the high-spatial frequency roughness of the multilayer film. An ion-assisted Mo-Si smoothing-layer approach to reticle substrate planarization, therefore, shows significant promise for defect mitigation in EUVL reticles
  • Keywords
    X-ray lithography; ion beam assisted deposition; molybdenum; optical fabrication; optical multilayers; reticles; silicon; substrates; ultraviolet lithography; EUVL reticles; Mo-Si; Mo-Si multilayer films; extreme ultraviolet lithography; high-spatial frequency roughness; ion-assistance; ion-assisted Mo-Si deposition process; lithographic image; particle-smoothing properties; planarizing; reflective multilayer films; reticle substrate planarization; reticle substrates; smoothing-layers; Coatings; Ion beams; Ion sources; Lithography; Nonhomogeneous media; Optical films; Smoothing methods; Sputter etching; Substrates; Ultraviolet sources;
  • fLanguage
    English
  • Journal_Title
    Quantum Electronics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9197
  • Type

    jour

  • DOI
    10.1109/3.970896
  • Filename
    970896