• DocumentCode
    1553363
  • Title

    DC and RF characteristics of advanced MIM capacitors for MMIC´s using ultra-thin remote-PECVD Si3N4 dielectric layers

  • Author

    Lee, Jae.-Hak. ; Kim, Dae-Hyun ; Park, Yong-Soon ; Sohn, Myoung-Kyu ; Seo, Kwang-Seok

  • Author_Institution
    Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
  • Volume
    9
  • Issue
    9
  • fYear
    1999
  • fDate
    9/1/1999 12:00:00 AM
  • Firstpage
    345
  • Lastpage
    347
  • Abstract
    We have fabricated advanced metal-insulator-metal (MIM) capacitors with ultra-thin (200 Å) remote-PECVD Si3N4 dielectric layers having excellent electrical properties. The breakdown field strength of MIM capacitors with 200-Å-thick Si3N 4 was larger than 3.5 MV/cm, which indicates the excellent quality of the deposited Si3N4 film. The main capacitance per unit area extracted by radio frequency (RF) measurements was as high as 2900 pF/mm2. Tenfold reduction of MIM capacitor size was successfully performed compared with conventional MIM capacitor with 2000-Å PECVD Si3N4 dielectric layer. Despite ultra-thin dielectric films of 200-Å thickness, the fabricated MIM capacitors showed good RF performance and high yield
  • Keywords
    MIM devices; MMIC; dielectric thin films; electric breakdown; plasma CVD coatings; silicon compounds; thin film capacitors; DC characteristics; MIM capacitor; MMIC; RF characteristics; Si3N4; Si3N4 ultra-thin dielectric film; breakdown field; capacitance; electrical properties; remote PECVD; yield; Area measurement; Capacitance measurement; Dielectric films; Dielectric measurements; Electric breakdown; Frequency measurement; MIM capacitors; Metal-insulator structures; Radio frequency; Semiconductor films;
  • fLanguage
    English
  • Journal_Title
    Microwave and Guided Wave Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1051-8207
  • Type

    jour

  • DOI
    10.1109/75.790469
  • Filename
    790469