Chandramouli, R. ; Dey, Shuvashis ; Hemmady, S. ; Mallipeddi, C. ; Rajsuman, R. ; Walther, R. ; Zorian, Y.
Volume :
14
Issue :
2
fYear :
1997
Firstpage :
81
Lastpage :
89
Keywords :
Chip scale packaging; Design methodology; Electronic design automation and methodology; Logic; Manufacturing; National electric code; Registers; System testing; Time to market; USA Councils;
