• DocumentCode
    1556121
  • Title

    Effects of package orientation and mixed convection on heat transfer from a PQFP

  • Author

    Sikka, Kamal K. ; Fisher, Timothy S. ; Torrance, Kenneth E. ; Lamb, Charles R.

  • Author_Institution
    Sibley Sch. of Mech. & Aerosp. Eng., Cornell Univ., Ithaca, NY, USA
  • Volume
    20
  • Issue
    2
  • fYear
    1997
  • fDate
    6/1/1997 12:00:00 AM
  • Firstpage
    152
  • Lastpage
    159
  • Abstract
    The thermal resistance of a surface-mount, plastic quad flat package (PQFP) was measured over a range of heating powers, air velocities, and package orientations. The specific package was one developed by a Joint Electronic Device Engineering Council (JEDEC) committee for standardized testing. The package was mounted in a low-speed wind tunnel which could be rotated in a vertical plane, thus changing the orientation of the package with respect to the gravity vector. Results define the limits of mixed convection for a horizontal package, and of orientation effects for package/tunnel orientations from buoyancy-opposing to buoyancy-assisting. For large air velocities greater than 2.5 m/s, for all tunnel orientations, the package thermal resistance shows a steep decrease, which is attributed to restarting of the surface boundary layer on the package
  • Keywords
    cooling; forced convection; integrated circuit packaging; plastic packaging; surface mount technology; thermal resistance; wind tunnels; JEDEC; PQFP; SMT; air velocities; buoyancy-assisting; buoyancy-opposing; gravity vector; heat transfer; heating powers; low-speed wind tunnel; mixed convection; orientation effects; package orientation; surface boundary layer; thermal resistance; Councils; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Plastic packaging; Power engineering and energy; Resistance heating; Surface resistance; Thermal resistance; Velocity measurement;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9886
  • Type

    jour

  • DOI
    10.1109/95.588567
  • Filename
    588567