DocumentCode
1556174
Title
Analyzing the mechanical strengths of SMT attached solder joints
Author
Chen, Wayne
Author_Institution
Northern Telecom Electron Inc., West Palm Beach, FL, USA
Volume
13
Issue
3
fYear
1990
fDate
9/1/1990 12:00:00 AM
Firstpage
553
Lastpage
558
Abstract
Analytic approaches to the pull strength and the shear strength of SMT (surface mount technology) attached solder joints are studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages was correlated with the experimentally measured data. The predictive models have been used for defining the design guidelines for selecting the optimum lead/pad configurations, the minimum solder volume, and the maximum component misalignment for fine-pitch SMT assemblies
Keywords
mechanical strength; packaging; shear strength; soldering; surface mount technology; SMT attached solder joints; design guidelines; fine-pitch SMT assemblies; leaded ceramic quad packages; mathematical models; maximum component misalignment; mechanical strengths; minimum solder volume; predictive models; pull strength; shear strength; Assembly; Ceramics; Consumer electronics; Guidelines; Lead; Packaging; Predictive models; Pulp manufacturing; Soldering; Surface-mount technology;
fLanguage
English
Journal_Title
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
0148-6411
Type
jour
DOI
10.1109/33.58858
Filename
58858
Link To Document