Title :
Analyzing the mechanical strengths of SMT attached solder joints
Author_Institution :
Northern Telecom Electron Inc., West Palm Beach, FL, USA
fDate :
9/1/1990 12:00:00 AM
Abstract :
Analytic approaches to the pull strength and the shear strength of SMT (surface mount technology) attached solder joints are studied by mathematical models. The predicted pull/shear strength of leaded ceramic quad packages was correlated with the experimentally measured data. The predictive models have been used for defining the design guidelines for selecting the optimum lead/pad configurations, the minimum solder volume, and the maximum component misalignment for fine-pitch SMT assemblies
Keywords :
mechanical strength; packaging; shear strength; soldering; surface mount technology; SMT attached solder joints; design guidelines; fine-pitch SMT assemblies; leaded ceramic quad packages; mathematical models; maximum component misalignment; mechanical strengths; minimum solder volume; predictive models; pull strength; shear strength; Assembly; Ceramics; Consumer electronics; Guidelines; Lead; Packaging; Predictive models; Pulp manufacturing; Soldering; Surface-mount technology;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
