Title :
Scaling with Design Constraints: Predicting the Future of Big Chips
Author :
Huang, Wei ; Rajamani, Karthick ; Stan, Mircea R. ; Skadron, Kevin
Author_Institution :
IBM Res., Austin, TX, USA
Abstract :
The past few years have witnessed high-end processors with increasing numbers of cores and larger dies. With limited instruction-level parallelism, chip power constraints, and technology-scaling limitations, designers have embraced multiple cores rather than single-core performance scaling to improve chip throughput. This article examines whether this approach is sustainable by scaling from a state-of-the-art big-chip design point using analytical models.
Keywords :
microprocessor chips; multiprocessing systems; power aware computing; big chip design constraints:; big chip scaling; chip power constraints; chip throughput; high-end processors; instruction-level parallelism; technology-scaling limitations; Computer architecture; Cooling; Industries; Program processors; Silicon; System-on-a-chip; Throughput; area; big chips; cooling solution; design constraints; many-core processor; power; processor architecture; system architecture; technology scaling; temperature;
Journal_Title :
Micro, IEEE