DocumentCode
1557206
Title
The effect of change of voltage acceleration on temperature activation of oxide breakdown for ultrathin oxides
Author
Wu, E.Y. ; McKenna, J.M. ; Lai, W. ; Nowak, E. ; Vayshenker, A.
Author_Institution
Microelectron. Div., IBM, Essex Junction, VT, USA
Volume
22
Issue
12
fYear
2001
Firstpage
603
Lastpage
605
Abstract
We report the effect of change of voltage acceleration on temperature dependence of oxide breakdown for ultra-thin oxides below 6 nm. The time- or charge-to-breakdown (T/sub BD//Q/sub BD/) is directly measured over a wide range of temperatures (-30/spl deg/C to 200/spl deg/C) for several fixed voltages using different area capacitors and long-term stress. Using extensive experimental evidence, we unequivocally demonstrate that this strong temperature dependence of oxide breakdown on ultra-thin oxides is not a thickness effect as previously suggested at least for thickness range investigated in this work. It is a consequence of two experimental facts: 1) voltage-dependent voltage acceleration and 2) temperature-independent voltage acceleration within a fixed T/sub BD/ window. These results provide a coherent picture for T/sub BD/ in both voltage and temperature domains for ultra-thin oxides.
Keywords
MOS capacitors; dielectric thin films; electric breakdown; semiconductor device breakdown; semiconductor device reliability; -30 to 200 C; 1.7 to 5.0 nm; CMOS process; MOS capacitors; NFET devices; Si-SiO/sub 2/; charge-to-breakdown; dielectric breakdown; long-term stress; p/sup +/poly/n-Si capacitors; reliability testing; temperature activation of oxide breakdown; temperature dependence; temperature-independent voltage acceleration; time-to-breakdown; ultra-large-scale integration; ultrathin oxides; voltage acceleration; voltage-dependent voltage acceleration; Acceleration; Area measurement; Breakdown voltage; Capacitors; Current measurement; Electric breakdown; Q measurement; Stress measurement; Temperature dependence; Temperature distribution;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/55.974592
Filename
974592
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