• DocumentCode
    1557303
  • Title

    Analysis of power/ground-plane EMI decoupling performance using the partial-element equivalent circuit technique

  • Author

    Archambeault, Bruce ; Ruehli, Albert E.

  • Author_Institution
    IBM, Raleigh, NC, USA
  • Volume
    43
  • Issue
    4
  • fYear
    2001
  • fDate
    11/1/2001 12:00:00 AM
  • Firstpage
    437
  • Lastpage
    445
  • Abstract
    The design of printed circuit (PC) boards with decoupling capacitors has been the subject of debate and different opinions for many years. The design and electrical impact of the capacitors has been difficult to separate from all other electrical interactions occurring on a conventional PC board populated with integrated circuits. This work demonstrates how the partial-element equivalent circuit (PEEC) modeling technique can be used to accurately predict the performance of various decoupling design strategies. Computer modeling using the PEEC approach is very flexible due to the ease of mixing physical geometries with a large number of circuit elements. Also, the compute time for such practical mixed EM and circuit problems are relatively short. Using this technique, the usual iteration between a number of different designs of test boards can be avoided. We show that the change of the voltage across the PC board, or the voltage gradient, can be used as an effective tool for the improvement of the decoupling efficiency
  • Keywords
    capacitors; circuit analysis computing; electric potential; electromagnetic compatibility; electromagnetic interference; equivalent circuits; printed circuit design; EM problems; EMC; PCB design; PEEC; circuit elements; circuit problems; computer modeling; decoupling design; decoupling efficiency; integrated circuits; partial-element equivalent circuit; physical geometries; power/ground-plane EMI decoupling; printed circuit board; voltage gradient; Capacitors; Computational geometry; Electromagnetic interference; Equivalent circuits; Performance analysis; Physics computing; Predictive models; Printed circuits; Solid modeling; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electromagnetic Compatibility, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9375
  • Type

    jour

  • DOI
    10.1109/15.974623
  • Filename
    974623