Title :
Frequency-dependent losses on high-performance interconnections
Author :
Deutsch, Alina ; Kopcsay, Gerard V. ; Coteus, Paul W. ; Surovic, Christopher W. ; Dahlen, Paul E. ; Heckmann, David L. ; Duan, Dah-Weih
Author_Institution :
Div. of Res., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA
fDate :
11/1/2001 12:00:00 AM
Abstract :
This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems and reviews their electrical characteristics. Measurement results of dielectric loss are shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are given for when losses are significant, and predictions are made for the sustainable bandwidths on useful wiring lengths
Keywords :
dielectric loss measurement; driver circuits; glass ceramics; integrated circuit interconnections; printed circuit testing; printed circuits; thin film circuits; PCB; attenuation; bandwidth; chip-to-chip interconnections; dielectric loss; driver circuits; electrical characteristics; frequency-dependent losses; high-performance communication systems; high-performance computers; high-performance interconnections; on-chips interconnections; printed circuit board; printed-circuit-board; pulse distortion; receiver circuits; simulation results; wiring lengths; Attenuation measurement; Dielectric loss measurement; Dielectric measurements; Electric variables; Frequency; Integrated circuit interconnections; Loss measurement; Semiconductor device measurement; System-on-a-chip; Wiring;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
