Title :
Wavelet-based high-order adaptive modeling of lossy interconnects
Author :
Grivet-Talocia, S. ; Canavero, F.
Author_Institution :
Dipt. di Elettronica, Politecnico di Torino, Italy
fDate :
11/1/2001 12:00:00 AM
Abstract :
This paper presents a numerical-modeling strategy for simulation of fast transients in lossy electrical interconnects. The proposed algorithm makes use of wavelet representations of voltages and currents along the structure, with the aim of reducing the computational complexity of standard time-domain solvers. A special weak procedure for the implementation of possibly dynamic and nonlinear boundary conditions allows one to preserve stability as well as a high approximation order, thus leading to very accurate schemes. On the other hand, the wavelet expansion allows the computation of the solution by using few significant coefficients which are automatically determined at each time step. A dynamically refinable mesh is then used to perform a sparse time-stepping. Several numerical results illustrate the high efficiency of the proposed algorithm, which has been tuned and optimized for best performance in fast digital applications typically found on modern PCB structures
Keywords :
absorbing media; adaptive systems; approximation theory; computational complexity; digital simulation; interconnections; multiconductor transmission lines; printed circuits; transient analysis; wavelet transforms; FDTD; PCB structures; computational complexity reduction; currents; dynamic boundary conditions; dynamically refinable mesh; fast transients simulation; high-order approximation; lossy electrical interconnects; multiconductor transmission lines; nonlinear boundary conditions; sparse time-stepping; time-domain solvers; transient analysis; voltage; wavelet expansion; wavelet representation; wavelet-based high-order adaptive modeling; Boundary conditions; Computational modeling; Dielectric losses; Equations; Finite difference methods; Integrated circuit interconnections; Power system transients; Stability; Termination of employment; Time domain analysis;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on