DocumentCode
1557342
Title
Experimental equivalent-circuit modeling of SMD inductors for printed circuit applications
Author
Naishadharn, K.
Author_Institution
Philips Broadband Networks, Syracuse, NY
Volume
43
Issue
4
fYear
2001
fDate
11/1/2001 12:00:00 AM
Firstpage
557
Lastpage
565
Abstract
An understanding of the high-frequency parasitic and packaging effects of passive surface-mounted devices (SMDs) can be gained from equivalent-circuit characterization of the device. We develop a circuit model which accurately characterizes the nonideal behavior of SMD inductors mounted on a printed circuit board (PCB), considering the device packaging and the interaction between board layout and component parasitics. The model is valid over a wide frequency band up to the first resonance of the inductor. The equivalent-circuit parameters are extracted in closed form from an accurate measurement of the S-parameters of the board-mounted SMD inductor, without the necessity for cumbersome optimization procedures normally followed in RF circuit synthesis. This procedure of measuring the component in its designed PCB environment is referred to as extrinsic characterization, in contrast to the conventional intrinsic characterization employed in RF bridges and LCR meters, which does not include the board layout effects. The developed closed-form model can be directly incorporated in commercial CAD packages, and thus, it simplifies the analysis of electromagnetic field behavior in PCBs, such as prediction of radiated emissions, signal integrity, and EMI
Keywords
S-parameters; electromagnetic fields; electromagnetic interference; equivalent circuits; inductors; printed circuit layout; printed circuit testing; surface mount technology; EMI; LCR meters; PCB layout; RF bridges; RF circuit synthesis; S-parameters measurement; SMD inductors; board layout; board-mounted SMD inductor; closed-form model; commercial CAD packages; component parasitics; electromagnetic field behavior; equivalent-circuit parameters; experimental equivalent-circuit modeling; extrinsic characterization; high-frequency parasitic effects; intrinsic characterization; packaging effects; passive surface-mounted devices; printed circuit applications; printed circuit board; radiated emissions; signal integrity; Bridge circuits; Circuit synthesis; Electromagnetic modeling; Inductors; Packaging; Predictive models; Printed circuits; Radio frequency; Resonance; Scattering parameters;
fLanguage
English
Journal_Title
Electromagnetic Compatibility, IEEE Transactions on
Publisher
ieee
ISSN
0018-9375
Type
jour
DOI
10.1109/15.974635
Filename
974635
Link To Document