Title :
Power-supply decoupling on fully populated high-speed digital PCBs
Author :
Ricchiuti, Vittorio
Author_Institution :
CNX S.p.A., L´´Aquila, Italy
fDate :
11/1/2001 12:00:00 AM
Abstract :
The effectiveness of buried capacitance technology, used with discrete surface mounted decoupling capacitors, in reducing circuit malfunctions due to the noise voltage between power/ground planes in a multilayer printed circuit board is investigated. The analysis is carried out on a fully populated multilayer board, where an integrated circuit with very large package provides a lot of digital signals with measured rise/fall times equal to 400 ps. The role of the integrated circuit´s package in damping out the resonance peaks at resonance frequencies on the power plane is highlighted. The relations between the power-bus transfer impedance and noise spectrum are also studied, in order to better evaluate the effects of the buried capacitance technology and decoupling capacitors on the power-bus noise filtering
Keywords :
application specific integrated circuits; capacitance; digital integrated circuits; electric impedance; electric potential; integrated circuit noise; integrated circuit packaging; power supplies to apparatus; printed circuits; resonance; surface mount technology; 400 ps; ASIC; board resonances damping; buried capacitance technology; circuit malfunctions reduction; decoupling capacitors; digital signals; discrete surface mounted decoupling capacitors; high-speed digital PCB; integrated circuit; integrated circuit package; measured rise/fall times; multilayer printed circuit board; noise spectrum; power-bus noise filtering; power-bus transfer impedance; power-supply decoupling; power/ground planes; resonance frequencies; Capacitance; Capacitors; Integrated circuit noise; Integrated circuit packaging; Integrated circuit technology; Noise reduction; Nonhomogeneous media; Resonance; Surface-mount technology; Voltage;
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
