Title :
Hearing with bionic ears [cochlear implant devices]
Author :
Ay, Suat U. ; Zeng, Fan-Gang ; Sheu, Bing J.
Author_Institution :
Dept. of Electr. Eng., Univ. of Southern California, Los Angeles, CA,USA
fDate :
5/1/1997 12:00:00 AM
Abstract :
According to speech perception-rate data continuous interleaved sampling (CIS) and spectral maxima sound processor (SMSP) techniques are, and probably will be, the best speech processing strategies for multichannel electrode cochlear implant devices. From packaging and power-consumption viewpoints, today´s speech processing systems are very big and are, therefore, worn on the body and consume large electric power. Next-generation cochlear implant devices would be more compact, low-power products that would be worn behind or in the ear. It is clear that mixed-signal, high-density, and low-power design techniques are required to satisfy compactness, as well as low-power consumption features to realize intelligent speech sensation for the implantees. The especially critical design consideration of power supply lifetime and efficiency might be increased by using new promising technologies like microelectromechanical systems (MEMS)
Keywords :
hearing aids; integrated circuit design; mixed analogue-digital integrated circuits; prosthetics; speech processing; cochlear implant devices; continuous interleaved sampling; intelligent speech sensation; low-power design techniques; microelectromechanical systems; mixed-signal design; multichannel electrode; packaging; power consumption; spectral maxima sound processor; speech perception-rate data; speech processing strategies; Auditory system; Cochlear implants; Computational Intelligence Society; Ear; Electrodes; Microelectromechanical systems; Packaging; Power supplies; Sampling methods; Speech processing;
Journal_Title :
Circuits and Devices Magazine, IEEE
