DocumentCode :
1557495
Title :
Design rules for field plate edge termination in SiC Schottky diodes
Author :
Tarplee, Marc C. ; Madangarli, Vipin P. ; Zhang, Quinchun ; Sudarshan, Tangali S.
Author_Institution :
Dept. of Electr. Eng., Univ. of South Carolina, Columbia, SC, USA
Volume :
48
Issue :
12
fYear :
2001
fDate :
12/1/2001 12:00:00 AM
Firstpage :
2659
Lastpage :
2664
Abstract :
Practical design of silicon carbide (SiC) Schottky diodes incorporating a field plate necessitates an understanding of how the addition of the field plate affects the performance parameters and the relationship between the diode structure and diode performance. In this paper, design rules are presented for SiC Schottky diodes that incorporate field plate edge termination. The use of an appropriate field plate edge termination can improve the reverse breakdown voltage of a SiC Schottky diode by a factor of two. Reverse breakdown voltage values can be obtained that are up to 88% of the theoretical maximums
Keywords :
Schottky diodes; semiconductor device breakdown; silicon compounds; wide band gap semiconductors; SiC; design rules; field plate edge termination; reverse breakdown voltage; silicon carbide Schottky diode; Avalanche breakdown; Doping; Electric breakdown; Electrodes; Equations; Helium; Impact ionization; Schottky diodes; Silicon carbide; Testing;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.974686
Filename :
974686
Link To Document :
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