DocumentCode :
1557719
Title :
On the performance advantage of PD/SOI CMOS with floating bodies
Author :
Pelella, Mario M. ; Fossum, Jerry G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
Volume :
49
Issue :
1
fYear :
2002
fDate :
1/1/2002 12:00:00 AM
Firstpage :
96
Lastpage :
104
Abstract :
The performance advantage of floating-body (FB) partially depleted (PD) SOI CMOS technology is analyzed via device/circuit simulations, with emphasis on providing insight into the physical mechanisms underlying the advantage. Comparisons of predicted propagation delay of contemporary and scaled FB PD/SOI CMOS, including hysteresis, with those of the bulk-Si and body-tied-to-source/SOI counterparts, all with controlled off-state current, are made, and the impact of junction capacitance, the kink effect, and capacitive-coupling effects are quantified. Scaling the technologies is shown to diminish the performance advantage of FB PD/SOI CMOS, but this tendency can be mitigated by typically elevated operating temperatures, stacked-transistor logic, and device-design optimization
Keywords :
CMOS integrated circuits; capacitance; delays; hysteresis; integrated circuit modelling; integrated circuit technology; semiconductor device models; silicon-on-insulator; PD/SOI MOSFETs; Si; capacitive-coupling effects; circuit simulation; controlled off-state current; device design optimization; device simulation; elevated operating temperatures; floating-body PD SOI CMOS technology; hysteresis; junction capacitance; kink effect; partially depleted SOI CMOS technology; performance advantage; process-based UFSOI compact model; propagation delay; stacked-transistor logic; technology scaling; unified model; CMOS technology; Capacitance; Circuit simulation; Coupling circuits; Hysteresis; MOSFET circuits; Radiative recombination; Semiconductor device modeling; Temperature; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.974755
Filename :
974755
Link To Document :
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