• DocumentCode
    1557721
  • Title

    Quasi-two-dimensional transmission line model (QTD-TLM) for planar ohmic contact studies

  • Author

    Chor, E.F. ; Lerdworatawee, Jongrit

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
  • Volume
    49
  • Issue
    1
  • fYear
    2002
  • fDate
    1/1/2002 12:00:00 AM
  • Firstpage
    105
  • Lastpage
    111
  • Abstract
    An analytical quasi-two-dimensional transmission tine model (QTD-TLM) has been formulated to more accurately extract the specific contact resistance (ρc) of ohmic contacts than the conventional one-dimensional TLM (1D-TLM). Similar to 1D-TLM, the extraction of ρc using QTD-TLM is straightforward. By means of the conformal mapping technique, the two-dimensional (2-D) (or lateral) current flow and current crowding, owing to the presence of a gap between the TLM mesa and contacts, are jointly incorporated into our model using a single shunt resistor. QTD-TLM is generalized as it is applicable to a variety of contact dimensions and gap widths, and to both alloyed and nonalloyed contacts. The validity of QTD-TLM has been verified experimentally using two alloyed and two nonalloyed ohmic contacts, and by comparison with results from a 2-D numerical model
  • Keywords
    contact resistance; ohmic contacts; semiconductor device models; semiconductor-metal boundaries; transmission line theory; 2D current flow; alloyed contacts; conformal mapping technique; contact dimensions; current crowding; gap widths; lateral current flow; metal/semiconductor ohmic contact; nonalloyed contacts; planar ohmic contacts; quasi-2D transmission line model; quasi-two-dimensional TLM; single shunt resistor; specific contact resistance; Analytical models; Conformal mapping; Contact resistance; Electric resistance; Electrical resistance measurement; Numerical models; Ohmic contacts; Planar transmission lines; Proximity effect; Resistors;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.974756
  • Filename
    974756