• DocumentCode
    1557747
  • Title

    Lateral thin-film Schottky (LTFS) rectifier on SOI: a device with higher than plane parallel breakdown voltage

  • Author

    Singh, Yashvir ; Kumar, M. Jagadesh

  • Author_Institution
    Centre for Appl. Res. in Electron., Indian Inst. of Technol., New Delhi, India
  • Volume
    49
  • Issue
    1
  • fYear
    2002
  • fDate
    1/1/2002 12:00:00 AM
  • Firstpage
    181
  • Lastpage
    184
  • Abstract
    In this work, we report a lateral thin-film Schottky (LTFS) rectifier on a highly doped SOI epitaxial layer. Based on two-dimensional (2-D) numerical simulations, we demonstrate for the first time that, for an epitaxial doping of 1017 cm-3 , breakdown voltages as large as 60 V (about six times higher than the plane parallel breakdown voltage) can be achieved using the proposed structure with very low reverse leakage current. Further, the forward voltage drop of the proposed device is shown to be as low as 0.27 V even at a current density 100 A/cm2. The reasons for improved performance of the LTFS rectifier are analyzed and the effects of film thickness, Schottky barrier height, and the Si-SiO2 interface states on the device performance are also reported
  • Keywords
    Schottky barriers; Schottky diodes; heavily doped semiconductors; interface states; leakage currents; semiconductor device breakdown; semiconductor device models; silicon-on-insulator; solid-state rectifiers; thin film devices; 0.27 V; 2D numerical simulations; 60 V; LTFS rectifier; Schottky barrier height; Si-SiO2; Si-SiO2 interface states; barrier lowering; breakdown voltages; epitaxial doping; film thickness; forward voltage drop; highly doped SOI epitaxial layer; lateral thin-film Schottky rectifier; low reverse leakage current; Current density; Doping; Epitaxial layers; Leakage current; Numerical simulation; Rectifiers; Thin film devices; Transistors; Two dimensional displays; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.974767
  • Filename
    974767