`Merged´ technologies: present capabilities and value for applications in high-voltage and `smart power´ circuitry

Author

Emerald, Paul R.

Author_Institution

Sprague Semicond. Group, Worcester, MA, USA

Volume

26

Issue

6

fYear

1990

Firstpage

1124

Lastpage

1130

Abstract

The multimerged technologies applicable to use in advanced high-voltage and smart power ICs are described. The various combinations of merged process (bipolar with MOS), merged function (sensor with control and logic and/or power), and mixed-signal (analog and digital) are outlined. Related basic tables of electrical ratings and relative merits are contrasted, and key concerns, such as strengths and weaknesses, are mentioned. Additionally, a pair of representative circuit examples, including an innovative system-on-a-chip, are provided. These illustrate and highlight actual prospects for a greater integration of high-voltage and smart power circuitry and concentrate on activities and opportunities such as appliances, automotive, consumer, and industrial products

Keywords

monolithic integrated circuits; power electronics; power integrated circuits; HV circuits; MOS; bipolar; control; electrical ratings; merged function; merged process; sensor; smart power IC; system-on-a-chip; CMOS analog integrated circuits; CMOS logic circuits; CMOS process; Complexity theory; Costs; Integrated circuit packaging; Intelligent sensors; Logic design; Silicon; Time factors;

fLanguage

English

Journal_Title

Industry Applications, IEEE Transactions on

Publisher

ieee

ISSN

0093-9994

Type

jour

DOI

10.1109/28.62398

Filename

62398