DocumentCode :
1558434
Title :
Shape-based optimal estimation and design of curve evolution processes with application to plasma etching
Author :
Berg, Jordan M. ; Zhou, Nan
Author_Institution :
Dept. of Mech. Eng., Texas Tech. Univ., Lubbock, TX, USA
Volume :
46
Issue :
12
fYear :
2001
fDate :
12/1/2001 12:00:00 AM
Firstpage :
1862
Lastpage :
1873
Abstract :
Considers the problem of determining a finite number of discrete parameters appearing in a nonlinear partial differential equation describing a curve evolution process. The method is applied to the plasma etching of thin films for semiconductor manufacturing. Results are obtained within the mathematical framework of level set methods. Here, the evolution of the curve under study is captured through the evolution of a level set function. The underlying physics of the process are completely contained in a scalar function called the speed function. The degree of difficulty of treating the evolution equation depends on the functional dependencies of the speed function. The paper presents optimal estimation and design techniques based on analytical gradient computations for a class of position and orientation dependent speed functions. The technique is demonstrated on a plasma etching model taken from the literature. Only simulation results are presented, but the model under study has been shown to reproduce experimental data with reasonable accuracy. In the estimation problem, parameters in the model are fit to best match the feature shape measured in experiments. In the optimal design problem, parameter values are selected to most closely attain a desired feature shape
Keywords :
nonlinear differential equations; nonlinear programming; parameter estimation; partial differential equations; process control; semiconductor process modelling; semiconductor thin films; set theory; sputter etching; analytical gradient computations; curve evolution processes; evolution equation; feature shape; level set methods; nonlinear partial differential equation; parameter estimation; plasma etching; scalar function; semiconductor manufacturing; sensitivity equations; shape-based optimal design; shape-based optimal estimation; speed function; thin films; Etching; Level set; Partial differential equations; Physics; Plasma applications; Plasma materials processing; Plasma measurements; Semiconductor device manufacture; Semiconductor thin films; Shape measurement;
fLanguage :
English
Journal_Title :
Automatic Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9286
Type :
jour
DOI :
10.1109/9.975470
Filename :
975470
Link To Document :
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