DocumentCode :
1559738
Title :
SILC as a measure of trap generation and predictor of TBD in ultrathin oxides
Author :
Alam, Muhammad Ashraful
Author_Institution :
Agere Syst., Murray Hill, NJ, USA
Volume :
49
Issue :
2
fYear :
2002
fDate :
2/1/2002 12:00:00 AM
Firstpage :
226
Lastpage :
231
Abstract :
The theoretical basis of stress-induced leakage current (SILC) as a measure of bulk trap density within thin oxide films is explored. Contrary to popular belief, this measure is neither absolute, nor do most papers in the literature sufficiently specify the measurement conditions to make their comparison meaningful. We also explore the relationship between SILC generation rate and the time-to-breakdown, and show that only a very specific definition of SILC generation can capture the voltage dependence of the time-to-breakdown
Keywords :
MOSFET; electron traps; extrapolation; hole traps; insulating thin films; leakage currents; semiconductor device breakdown; semiconductor device models; semiconductor device reliability; MOS devices; NMOS devices; PMOS devices; bulk trap density; defect-assisted tunneling current; device modeling; device reliability; electron barrier height; nonlinear approximation; stress-induced leakage current; time-to-breakdown prediction; trap creation; ultrathin oxides; Current measurement; Density measurement; Electron traps; Leakage current; MOSFETs; Semiconductor device reliability; Stress measurement; Thickness measurement; Tunneling; Voltage;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.981211
Filename :
981211
Link To Document :
بازگشت