• DocumentCode
    15599
  • Title

    Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm

  • Author

    Zhuo-Yue Li ; Mu-Shui Zhang

  • Author_Institution
    Dept. of Electron. & Commun. Eng., Sun Yat-sen Univ., Guangzhou, China
  • Volume
    5
  • Issue
    2
  • fYear
    2015
  • fDate
    Feb. 2015
  • Firstpage
    232
  • Lastpage
    244
  • Abstract
    In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, where the basic concepts of GA optimization are introduced and some important considerations for package design are demonstrated. A customized GA flow and two accelerating strategies are developed to improve the efficiency of the optimization procedure. Using GA optimization, the P/G pin assignment of a 40 × 40 BGA package with blocks of core, inputs/outputs and differential pairs can be generated in a few tens of minutes automatically.
  • Keywords
    ball grid arrays; genetic algorithms; integrated circuit packaging; GA optimization flow; P/G pin assignment optimization; core block; differential pair; genetic algorithm; large-scale high-pin-count BGA package; large-scale high-pin-count ball grid array package; package design; power integrity; power/ground pin optimization method; signal integrity; Biological cells; Genetic algorithms; Inductance; Linear programming; Optimization; Pins; Silicon; Ball grid array (BGA) package; pin assignment; signal integrity (SI); system in package (SiP); system in package (SiP).;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2386855
  • Filename
    7008440