DocumentCode
15599
Title
Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm
Author
Zhuo-Yue Li ; Mu-Shui Zhang
Author_Institution
Dept. of Electron. & Commun. Eng., Sun Yat-sen Univ., Guangzhou, China
Volume
5
Issue
2
fYear
2015
fDate
Feb. 2015
Firstpage
232
Lastpage
244
Abstract
In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, where the basic concepts of GA optimization are introduced and some important considerations for package design are demonstrated. A customized GA flow and two accelerating strategies are developed to improve the efficiency of the optimization procedure. Using GA optimization, the P/G pin assignment of a 40 × 40 BGA package with blocks of core, inputs/outputs and differential pairs can be generated in a few tens of minutes automatically.
Keywords
ball grid arrays; genetic algorithms; integrated circuit packaging; GA optimization flow; P/G pin assignment optimization; core block; differential pair; genetic algorithm; large-scale high-pin-count BGA package; large-scale high-pin-count ball grid array package; package design; power integrity; power/ground pin optimization method; signal integrity; Biological cells; Genetic algorithms; Inductance; Linear programming; Optimization; Pins; Silicon; Ball grid array (BGA) package; pin assignment; signal integrity (SI); system in package (SiP); system in package (SiP).;
fLanguage
English
Journal_Title
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher
ieee
ISSN
2156-3950
Type
jour
DOI
10.1109/TCPMT.2014.2386855
Filename
7008440
Link To Document