Title :
Millimeter-wave FET modeling using on-wafer measurements and EM simulation
Author :
Cidronali, Alessandro ; Collodi, Giovanni ; Santarelli, Alberto ; Vannini, Giorgio ; Manes, Gianfranco
Author_Institution :
Dept. of Electron. & Telecommun., Univ. of Firenze, Italy
fDate :
2/1/2002 12:00:00 AM
Abstract :
Electron device modeling is a challenging task at millimeter-wave frequencies. In particular, conventional approaches based on lumped equivalent circuits become inappropriate to describe complex distributed and coupling effects, which may strongly affect the transistor performance. In this paper, an empirical distributed FET model is adopted that can be identified on the basis of conventional S-parameter measurements and electromagnetic simulations of the device layout. The consistency of the proposed approach is confirmed by robust scaling properties, which enable millimeter-wave small-signal S-parameters to be predicted as a function of the device periphery and number of gate fingers. Moreover, it is shown how the model identified on the basis of standard S-parameter measurements up to 50 GHz can be efficiently exploited in order to obtain reasonably accurate small-signal prediction up to 110 GHz. Extensive experimental validation is presented for 0.2-μm pseudomorphic high electron-mobility transistors devices
Keywords :
S-parameters; high electron mobility transistors; millimetre wave field effect transistors; millimetre wave measurement; semiconductor device measurement; semiconductor device models; 0.2 micron; 50 to 110 GHz; coupling effects; electromagnetic simulation; electron device; empirical distributed model; millimeter-wave FET; on-wafer measurement; pseudomorphic high electron mobility transistor; scaling properties; small-signal S-parameters; Coupling circuits; Electromagnetic modeling; Electron devices; Equivalent circuits; FETs; Frequency measurement; Millimeter wave circuits; Millimeter wave measurements; Millimeter wave transistors; Scattering parameters;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on