DocumentCode
1560104
Title
Heterogeneous integration through electrokinetic migration
Author
Ozkan, Mihrimah ; Ozkan, Cengiz S. ; Kibar, Osman ; Wang, Mark M. ; Bhatia, Sangeeta ; Esener, Sadik C.
Author_Institution
Electr. Eng. Dept., Univ. of California, Riverside, CA, USA
Volume
20
Issue
6
fYear
2001
Firstpage
144
Lastpage
151
Abstract
We apply basic electrophoretic motion to semiconductor materials engineering for development of the next level of heterogeneous integration technology. Furthermore, we demonstrate the utility of these tools in integration of inorganic devices with biological species in order to explore the utility of these tools in biotechnological applications.Electrical and optical addressing techniques are shown to allow for more rapid and parallel patterning of biological species and inorganic objects.
Keywords
DNA; biological techniques; biomolecular electronics; biotechnology; electrochemical electrodes; electrokinetic effects; electrophoresis; microfluidics; photoelectrochemistry; self-assembly; Coulomb repulsion; DNA; biological species; biotechnological applications; current-voltage characteristics; electrical field addressing; electrochemical system; electrokinetic migration; electrophoretic motion; heterogeneous integration technology; immobilized cells; inorganic devices integration; liquid-solid junctions; live mammalian cells; microelectrophoresis; optical addressing; optoelectrochemical circuit; optoelectronic addressing; photocurrent; pick-and-place patterning; potential drop; self-assembly; semiconductor materials engineering; solid-state band energy distribution; Biomedical optical imaging; Electrodes; Electrokinetics; Gaskets; Glass; Indium tin oxide; Microfluidics; Pharmaceutical technology; Rubber; Self-assembly; Animals; Body Patterning; Cell Division; Data Display; Electrophoresis; Fibroblasts; Fibrosarcoma; Humans; Mice; Models, Chemical; Motion; Nanotechnology; Optics; Robotics; Semiconductors;
fLanguage
English
Journal_Title
Engineering in Medicine and Biology Magazine, IEEE
Publisher
ieee
ISSN
0739-5175
Type
jour
DOI
10.1109/51.982286
Filename
982286
Link To Document