• DocumentCode
    1560253
  • Title

    Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench

  • Author

    Iwase, Masayuki ; Nomura, Takehiko ; Izawa, Atsushi ; Mori, Hajime ; Tamura, Shuichi ; Shirai, Takehiro ; Kamiya, Tamotsu

  • Author_Institution
    Opt. Devices Dept., Furukawa Electr. Co. Ltd., Chiba, Japan
  • Volume
    24
  • Issue
    4
  • fYear
    2001
  • fDate
    11/1/2001 12:00:00 AM
  • Firstpage
    419
  • Lastpage
    428
  • Abstract
    Demand for a compact cost reduced optical transceiver has arisen. Small form factor (SFF) optical transceivers are expected to meet this demand. A new concept optical module based on V-grooved silicon optical bench (SiOB) technology, that enables a passive alignment of optical fibers and optical devices is expected to reduce the cost. MT-RJ SFF optical transceivers require this new packaging technique because the distance between input and output optical axes is shorter than conventional transceivers. However, crosstalk between a transmitter and a receiver is a big issue to be solved because the distance between optical axes of the laser diode (LD) and the photo diode (PD) is only 0.75 mm. It is difficult to reduce the crosstalk in a SiOB because large electromagnetic coupling exists due to the conductivity of a silicon substrate. A newly developed, low crosstalk optical subassembly (OSA) with a single mode fiber MT-RJ receptacle and the SFF transceiver module are reported. We have analyzed a mechanism of electrical crosstalk in a SiOB and developed a shield structure to reduce it. The crosstalk in the OSA with shielded SiOB was reduced over 20 dB compared to the unshielded SiOB
  • Keywords
    SONET; optical communication equipment; optical couplers; optical crosstalk; optical fibre networks; packaging; synchronous digital hierarchy; transceivers; 0.75 mm; MT-RJ connector; SONET/SDH; Si; V-grooved technology; crosstalk; electromagnetic coupling; optical subassembly; optical transceivers; packaging technique; passive alignment; shield structure; shielded silicon optical bench; single mode fiber; small form factor; Costs; Diode lasers; Optical crosstalk; Optical devices; Optical fibers; Optical receivers; Optical transmitters; Packaging; Silicon; Transceivers;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.982824
  • Filename
    982824