DocumentCode
1560259
Title
Foreword
Author
Elshabini, A.
Author_Institution
University of Arkansas
Volume
24
Issue
4
fYear
2001
Firstpage
463
Lastpage
463
Keywords
CMOS technology; Components, Packaging, and Manufacturing Technology Society; Electrical engineering; Frequency; Manufacturing processes; Mass production; Microelectronics; Microprocessors; Packaging; Production systems;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2001.982830
Filename
982830
Link To Document