Title :
Packaging technology for high performance CMOS server Fujitsu GS8900
Author :
Fujisaki, Akihiko ; Suzuki, Masahiro ; Yamamoto, Haruhiko
Author_Institution :
Packaging Technol. Div., Fujitsu Ltd., Kawasaki, Japan
fDate :
11/1/2001 12:00:00 AM
Abstract :
Advanced packaging technologies for CMOS based high performance Fujitsu Global Server GS8900, released in late 1999, are introduced in this paper. Extending a new standard for technological leadership among large-scale enterprise servers, the GS8900 broke the 2000 MIPS barrier in performance for the first time by taking advantages of Fujitsu advanced 0.18 μm copper wiring process and chip/MCM/system packaging capabilities, delivering a doubled performance in comparison to its predecessor. The packaging technologies are uniquely characterized in several aspects. First, the high density stacked via type MCM-D technology features four pairs of CPU tightly coupled multiprocessor and large capacity second caches, the maximum processor terminal count is more than 10,000. The processors are wired onto a multilayer thin film MCM substrate with 153 μm pitch high-density area array lead-free bumps. Secondly, maximum four CPU-MCMs, including 16 CPU processors, and 64 GB main memory modules are mounted on one multilayer system board of high frequency transmission properties. Each MCM is held through a high-density ZIF connector of around 3000 I/Os in a 1.27 mm pitch full matrix, which is assembled on the system board with lead-free solders. Thirdly, advanced cooling technologies are developed for improving the system performance and reliability
Keywords :
cooling; electric connectors; fine-pitch technology; flip-chip devices; multichip modules; network servers; printed circuits; soldering; thermal management (packaging); 0.18 micron; 1.27 mm; 153 micron; 2000 MIPS; 64 GB; CMOS based servers; CPU-MCMs; Cu; Fujitsu Global Server GS8900; MCM cooling; advanced cooling technologies; advanced packaging technologies; air-cooled model; chip/MCM/system packaging; copper wiring process; flip-chip assemblies; high density stacked via type MCM-D technology; high reliability; high-density ZIF connector; high-density area array bumps; large capacity caches; lead-free solders; low-temperature liquid cooling system; memory modules; multilayer system board; multilayer thin film MCM substrate; multiprocessor; operating temperatures; robust design; thermosyphons; turbo model; CMOS technology; Copper; Environmentally friendly manufacturing techniques; Large-scale systems; Lead; Nonhomogeneous media; Packaging; Substrates; Transistors; Wiring;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.982831