Mechanical deflection system (MDS) test and methodology for PBGA solder joint reliability

Author

Pang, John H L ; Ang, Kar Hwee ; Shi, Xunquig Q. ; Wang, Z.P.

Author_Institution

Sch. of Mech. & Production Eng., Nanyang Technol. Univ., Singapore

Volume

24

Issue

4

fYear

2001

fDate

11/1/2001 12:00:00 AM

Firstpage

507

Lastpage

514

Abstract

A mechanical deflection system (MDS) was developed for highly accelerated tests to evaluate the solder joint fatigue performance in printed circuit board assemblies. The MDS test system can be used for design verification and qualification tests for solder joint reliability. Cyclic twisting deformation is imposed on an assembled printed circuit board (PCB) at isothermal conditions. The MDS test technique makes a significant contribution to reducing solder joint reliability testing cycle time. Fatigue performance of the PBGA solder joints subjected to the MDS test was investigated by three-dimensional finite element modeling. The solder joint fatigue lives were computed for several different MDS test conditions

Keywords

ball grid arrays; circuit reliability; fatigue testing; finite element analysis; life testing; plastic packaging; printed circuit manufacture; reflow soldering; surface mount technology; thermal management (packaging); PBGA; Weibull curves; cyclic twisting deformation; design verification; fatigue performance; highly accelerated tests; isothermal conditions; mechanical deflection system; printed circuit board assemblies; qualification tests; solder joint reliability; thermal test chamber; three-dimensional finite element modeling; Assembly systems; Circuit testing; Fatigue; Finite element methods; Isothermal processes; Life estimation; Printed circuits; Qualifications; Soldering; System testing;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.982837

Filename

982837