Complete methodology for electrical modeling of RFIC packages

Author

Horng, Tzyy-Sheng ; Wu, Sung-Mao ; Shih, Charlie

Author_Institution

Dept. of Electr. Eng., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan

Volume

24

Issue

4

fYear

2001

fDate

11/1/2001 12:00:00 AM

Firstpage

542

Lastpage

547

Abstract

A complete methodology based on broadband S-parameter measurement is proposed to establish the electrical models for radio-frequency integrated circuit (RFIC) packages. The research is focused on calibration of the test-fixture parasitics to obtain the intrinsic S-parameters from which an equivalent coupled lumped model can be extracted for any pair of package leads under test. Then a step-by-step optimization scheme is employed to construct an equivalent circuit for the whole package. A real example on modeling a 16-lead Thin Shrink Small Outline Package (TSSOP) has been demonstrated. The established model can account for various package effects at radio frequencies

Keywords

S-parameters; UHF integrated circuits; calibration; equivalent circuits; integrated circuit measurement; integrated circuit modelling; integrated circuit packaging; microwave integrated circuits; microwave measurement; 12 GHz; 16-lead TSSOP; MIC; RFIC packages; broadband S-parameter measurement; calibration; electrical modeling; equivalent circuit; equivalent coupled lumped model; intrinsic S-parameters; optimization scheme; radiofrequency IC packages; radiofrequency integrated circuits; test-fixture parasitics; thin shrink small outline package; Calibration; Circuit testing; Coupling circuits; Electric variables measurement; Equivalent circuits; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; Radiofrequency integrated circuits; Scattering parameters;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.982842

Filename

982842