Measurements and modeling of two-phase flow in microchannels with nearly constant heat flux boundary conditions

Author

Zhang, Lian ; Koo, Jae-Mo ; Jiang, Linan ; Asheghi, Mehdi ; Goodson, Kenneth E. ; Santiago, Juan G. ; Kenny, Thomas W.

Author_Institution

Dept. of Mech. Eng., Stanford Univ., CA, USA

Volume

11

Issue

1

fYear

2002

fDate

2/1/2002 12:00:00 AM

Firstpage

12

Lastpage

19

Abstract

Two-phase forced convective flow in microchannels is promising for the cooling of integrated circuits. There has been limited research on boiling flow in channels with dimensions below 100 μm, in which bubble formation and flow regimes can differ from those in larger channels. This work develops single and multi-channel experimental structures using plasma-etched silicon with pyrex glass cover, which allow uniform heating and spatially-resolved thermometry and provide optical access for visualization of boiling regimes. Boiling was observed with less than 5°C of super-heating in rectangular channels with hydraulic diameters between 25 and 60 μm. The channel wall widths are below 350 μm, which minimizes solid conduction and reduces variations in the heat flux boundary condition. Pressure drop and wall temperature distribution data are consistent with predictions accounting for solid conduction and homogeneous two-phase convection

Keywords

boiling; channel flow; cooling; flow simulation; forced convection; heat exchangers; integrated circuit packaging; microfluidics; silicon; temperature distribution; temperature measurement; thermal analysis; thermal management (packaging); two-phase flow; 25 to 350 micron; IC cooling; Si; boiling regimes visualisation; forced convective flow; heat exchanger; homogeneous two-phase convection; integrated circuits; microchannels; modeling; multichannel experimental structures; nearly constant heat flux boundary conditions; plasma-etched Si; pressure drop data; pyrex glass cover; rectangular channels; single channel experimental structures; solid conduction; spatially-resolved thermometry; superheating; two-phase cooling; two-phase flow; uniform heating; wall temperature distribution data; Cooling; Fluid flow measurement; Glass; Heating; Integrated circuit measurements; Microchannel; Plasmas; Silicon; Solids; Visualization;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.982858

Filename

982858