A silicon-etched probe for 3-D coordinate measurements with an uncertainty below 0.1 μm

Author

Haitjema, Han ; Pril, Wouter ; Schellekens, P.H.J.

Author_Institution

Sect. Precision Eng., Eindhoven Univ. of Technol., Netherlands

Volume

50

Issue

6

fYear

2001

fDate

12/1/2001 12:00:00 AM

Firstpage

1519

Lastpage

1523

Abstract

The increasing demand for accurate coordinate measurements on products demands new concepts of probe design. Results of some realized designs are given. One of the most promising utilizes microtechnology and etching in silicon in order to realize the necessary dimensional design with flexure hinges. Microtechnology is also used for the detection system; strain gages are integrated in the probe. Results for two probes are given and possible future developments are discussed

Keywords

calibration; elemental semiconductors; etching; inspection; micromachining; microsensors; silicon; spatial variables measurement; strain gauges; 3D coordinate measurements; CMM probe; MEMS; Si; accurate coordinate measurements; accurate dimensional inspection; calibration; flexure hinges; integrated strain gages; silicon-etched probe; touch trigger probe; Coordinate measuring machines; DVD; Electrical resistance measurement; Etching; Fasteners; Measurement uncertainty; Position measurement; Precision engineering; Probes; Silicon;

fLanguage

English

Journal_Title

Instrumentation and Measurement, IEEE Transactions on

Publisher

ieee

ISSN

0018-9456

Type

jour

DOI

10.1109/19.982938

Filename

982938