DocumentCode :
1560440
Title :
Modeling of single-event effects in circuit-hardened high-speed SiGe HBT logic
Author :
Niu, Guofu ; Krithivasan, Ramkumar ; Cressler, John D. ; Marshall, Paul ; Marshall, Cheryl ; Reed, Robert ; Harame, David L.
Author_Institution :
Dept. of Electr. & Comput. Eng., Auburn Univ., AL, USA
Volume :
48
Issue :
6
fYear :
2001
fDate :
12/1/2001 12:00:00 AM
Firstpage :
1849
Lastpage :
1854
Abstract :
This paper presents single-event effect (SEE) modeling results of circuit-hardened SiGe heterojunction bipolar transistor logic circuits. A simple equivalent circuit is proposed to model the ion-induced currents at all of the terminals, including the p-type substrate. The SEE sensitivity of a D-flip-flop was simulated using the proposed equivalent circuit. The simulation results are qualitatively consistent with earlier SEE testing results. The circuit upset is shown to be independent of the number of active paths. Considerable charge collection occurs through the reverse-biased n-collector/p-substrate junction, regardless of the status of the emitter steering current, resulting in circuit upset through the commonly connected load resistor. A heavily doped substrate is shown to be beneficial for SEE
Keywords :
Ge-Si alloys; bipolar logic circuits; current-mode logic; equivalent circuits; flip-flops; heavily doped semiconductors; heterojunction bipolar transistors; integrated circuit modelling; radiation hardening (electronics); CML; D-flip-flop; SEE modeling; SEE sensitivity; SiGe; charge collection; circuit upset; circuit-hardened SiGe logic circuits; commonly connected load resistor; current-mode logic; equivalent circuit; heavily doped substrate; heterojunction bipolar transistor logic circuits; high-speed SiGe HBT logic; ion-induced currents; p-type substrate; reverse-biased n-collector/p-substrate junction; simulation; single-event effect modeling; Circuit simulation; Circuit testing; Electric variables; Equivalent circuits; Germanium silicon alloys; Heterojunction bipolar transistors; Logic circuits; Microwave technology; Semiconductor process modeling; Silicon germanium;
fLanguage :
English
Journal_Title :
Nuclear Science, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9499
Type :
jour
DOI :
10.1109/23.983141
Filename :
983141
Link To Document :
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