• DocumentCode
    1560479
  • Title

    Comparison of charge trapping in undoped oxides made by low- and high-temperature deposition techniques

  • Author

    Mrstik, B.J. ; Hughes, H.L. ; Lawrence, R.K. ; McMarr, P.J. ; Gouker, P.

  • Author_Institution
    Naval Res. Lab., Washington, DC, USA
  • Volume
    48
  • Issue
    6
  • fYear
    2001
  • fDate
    12/1/2001 12:00:00 AM
  • Firstpage
    2107
  • Lastpage
    2113
  • Abstract
    Charge trapping has been studied in a series of undoped low-pressure deposited oxides made using either silane and oxygen in a low-temperature oxidation (LTO) process or pure tetraethylorthosilicate (TEOS) in a high-temperature process. The extent of charge trapping was determined by measuring the flatband voltage shift ΔVfb, resulting from injection of either holes or electrons separately (using photo-assisted injection techniques) or from exposure to 10 keV X-rays, in which holes and electrons are simultaneously created in the oxide. It is found that hole trapping is similar in identically annealed LTO and TEOS oxides, but that electron trapping is much larger in the TEOS oxides. Electron trapping in TEOS oxides is also found to depend inversely on the electric field. These results are used to explain the observation that X-ray exposure results in much smaller changes in ΔVfb in TEOS oxides than in LTO oxides at low applied fields, but to equivalent changes in ΔV fb at high applied fields. O2 anneals, but not N 2 anneals, are found to decrease the extent of electron trapping in the TEOS oxides, supporting previous suggestions that the electron traps result from carbon in the TEOS gas
  • Keywords
    X-ray effects; annealing; dielectric thin films; electron traps; high-temperature techniques; hole traps; oxidation; silicon compounds; 10 keV; LTO oxides; LTO process; N2; N2 anneals; O2; O2 anneals; SiO2-Si; TEOS gas carbon content; TEOS high-temperature process; TEOS oxides; X-ray exposure; annealed oxides; applied fields; charge trapping; electric field; electron injection; electron trapping; electron traps; flatband voltage shift; high-temperature deposition techniques; hole injection; hole trapping; low-temperature deposition techniques; photo-assisted injection techniques; silane/oxygen low-temperature oxidation process; tetraethylorthosilicate high-temperature process; undoped low-pressure deposited oxides; undoped oxides; Annealing; Boron; Charge carrier processes; Electron traps; Laboratories; Oxidation; Paramagnetic materials; Paramagnetic resonance; Temperature; X-rays;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.983180
  • Filename
    983180