DocumentCode
156073
Title
Simulation of IC-packages for RF and MW applications
Author
Chukov, George V. ; Nazarova, Galina N. ; Nikiforov, A.Yu.
Author_Institution
Moscow Eng. Phys. Inst., Nat. Res. Nucl. Univ. MEPhI, Moscow, Russia
fYear
2014
fDate
7-13 Sept. 2014
Firstpage
131
Lastpage
132
Abstract
A new approach to characterization of IC-packages for RF and microwave applications based on electromagnetic simulation and vector measurements is presented. Following the approach the equivalent-circuit parameters and maximum working frequency have been evaluated for a variety of metal-ceramic and metal-glass packages produced domestically.
Keywords
equivalent circuits; integrated circuit packaging; microwave integrated circuits; IC-packages; RF; electromagnetic simulation; equivalent-circuit parameters; metal-ceramic; metal-glass packages; microwave; vector measurements; Electromagnetics; Extraterrestrial measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave & Telecommunication Technology (CriMiCo), 2014 24th International Crimean Conference
Conference_Location
Sevastopol
Print_ISBN
978-966-335-412-5
Type
conf
DOI
10.1109/CRMICO.2014.6959323
Filename
6959323
Link To Document