Title :
Proceedings of 7th Electronics Packaging Technology Conference (IEEE Cat. No.05EX1233C)
Abstract :
The following topics are dealt with: system-in-package; signal integrity; drop impact modeling; bio-MEMS and accelerometer packaging; reliability test methods; advanced packaging; electrical characterization; advanced reliability modeling; MEMS packaging; radiofrequency components; radiofrequency modules; lead free materials; lead free packaging; optoelectronics; electrical modeling and simulation; solder joint fatigue; flip chip interconnects; thermal modeling and characterization; delamination and hygroswelling; cooling solutions; manufacturing technology; solders and adhesives; reliability of lead-free solder joints
Keywords :
accelerometers; adhesives; cooling; delamination; electronics packaging; flip-chip devices; integrated circuit interconnections; micromechanical devices; optoelectronic devices; reliability; solders; system-in-package; MEMS packaging; accelerometer packaging; adhesives; bio-MEMS; bio-micromechanical devices; cooling solution; delamination; drop impact modeling; electrical modeling; electrical simulation; electronics packaging; flip chip interconnects; hygroswelling; lead free materials; lead free packaging; lead-free solder joints; manufacturing technology; micromechanical device packaging; optoelectronics; radiofrequency components; radiofrequency modules; reliability modeling; reliability test methods; signal integrity; solder joint fatigue; system-in-package; thermal characterization; thermal modeling;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614351
