Title :
Quilt packaging: a new paradigm for interchip communication
Author :
Bernstein, Gary H. ; Liu, Qing ; Sun, Zhuowen ; Fay, Patrick
Author_Institution :
Dept. of Electr. Eng., Notre Dame Univ., IN
Abstract :
"Quilt packaging," (QP) a new paradigm for interchip communication, is presented. QP uses conducting modules that protrude from the sides of integrated circuits to affect an enhanced-speed, reduced-power method of interfacing multiple die together within a package or on a multichip module. The concept of QP is introduced along with a discussion of advantages over traditional system-on-chip and system-in-package technologies. Details of a process flow and preliminary results are presented. Simulations show expected signal propagation between adjacent die of greater than 150 GHz
Keywords :
integrated circuit packaging; multichip modules; conducting modules; enhanced-speed method; interchip communication; multichip module; process flow; quilt packaging; reduced-power method; signal propagation; system-in-package; Clocks; Electronics packaging; Integrated circuit interconnections; Integrated circuit packaging; Integrated circuit technology; Multichip modules; Quadratic programming; Semiconductor device packaging; Sun; System-on-a-chip;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614357
