Title :
Industrially compatible PCB stacking technology for miniaturized sensor systems
Author :
Lang, K.-D. ; Grosser, V. ; Jam, K. Amiri ; Wolf, J. ; Semionyk, P. ; Schmitz, Saint ; Rochlitzer, R. ; Prietzsch, D. ; Reichl, H.
Author_Institution :
Fraunhofer IZM, Berlin
Abstract :
A new PCB stacking technology to improve the third dimension in system integration for miniaturized sensor systems has been presented. It is possible to use all well-known assembly technologies for subsystem-boards. With the final stacking step of these element-boards at panel level 3D high performance electronic or sensor systems can be produced effectively and with high yield. The PCB stacking technology is especially suitable for small and midsize production series. In cooperation with companies, first examples for logistics and sports are manufactured industrially
Keywords :
electronics packaging; microassembling; printed circuits; sensors; stacking; 3D system integration; PCB stacking technology; assembly technology; element-boards; miniaturized sensor systems; subsystem-boards; Assembly; Components, packaging, and manufacturing technology; Electronic components; Intelligent sensors; Mobile communication; Packaging; Sensor phenomena and characterization; Sensor systems; Stacking; Wireless sensor networks;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614359
